Document Type
Article
Publication Date
6-15-2021
Publication Title
Nanomanufacturing
Volume
1
Issue
1
First page number:
49
Last page number:
56
Abstract
Recent advances in the manipulation and control of layered, two-dimensional materials has given way to the construction of heterostructures with new functionality and unprecedented electronic properties. In this study, we present a simple technique to assemble and transfer van der Waals heterostructures using common nail polish. Commercially available nail polish acts as a resilient sticky polymer, allowing for the fabrication of complex multi-material stacks without noticeable fatigue. Directly comparing four commercially available brands of nail polish, we find that one stands out in terms of stability and stacking characteristics. Using this method, we fabricate two top-gated devices and report their electrical properties. Our technique reduces the complexity in assembling van der Waals heterostructures based on the proven van der Waals pick up method.
Keywords
2D material; van der Waals; assembly; stacking; pick up; nail polish; transfer
Disciplines
Polymer and Organic Materials
File Format
File Size
11700 KB
Language
English
Rights
IN COPYRIGHT. For more information about this rights statement, please visit http://rightsstatements.org/vocab/InC/1.0/
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 International License.
Repository Citation
Haley, K. L.,
Cloninger, J. A.,
Cerminara, K.,
Sterbentz, R. M.,
Taniguchi, T.,
Watanabe, K.,
Island, J. O.
(2021).
Heated Assembly and Transfer of Van der Waals Heterostructures with Common Nail Polish.
Nanomanufacturing, 1(1),
49-56.
http://dx.doi.org/10.3390/nanomanufacturing1010005